Industry
High Tech
High Tech Solutions to Drive Business Transformation through Technology
HIGHLIGHTS
- Semiconductor chips are the backbone of modern technology, powering devices and systems, revolutionizing the way we live, societies function, and enterprises operate.
- To meet diverse industry needs and to keep up with the complexity of designing next-generation integrated circuits (ICs), semiconductor companies need an ‘innovation first’ approach.
- TCS’ NextGen Chip Engineering Services provide expertise across the entire IC design cycle, from silicon implementation to advanced package design (APD), accelerating tapeout for next-generation chips.
Overview
Semiconductor chips are at the core of a digital future.
To stand out in a competitive market, semiconductor companies must keep pace with the rapidly evolving needs of technologies like artificial intelligence (AI), IoT, 5G, cloud, and high performing computing (HPC).
Meeting the diverse power and performance requirements across industries with accelerated time to market, requires rapid adoption of new silicon technologies, such as multi-die chiplets or advanced technology nodes.
TCS NextGen Chip Engineering Services draws on our experience in advanced silicon technologies, cross-domain expertise, and commitment to first-time-right delivery.
Solution
TCS’ technology innovation potential and product engineering expertise enable its customers in silicon engineering from concept to tapeout.
TCS NextGen Chip Engineering Services are backed by efficient design methodologies and deep domain expertise to address complex design challenges and reduce the time to market.
With comprehensive capabilities in digital IC design, we provide world-class expertise across the entire design cycle, which includes silicon implementation and advanced package design (see Figure 1).
End-to-end silicon engineering capabilities
Figure 1:
End-to-end silicon engineering capabilities
With silicon implementation, TCS can:
- Create efficient logical designs across Verilog, SystemVerilog and VHDL, with expertise in complex system on chip (SoC) integration, and high-speed protocols such as universal chiplet interconnect express™ (UCIe™), peripheral component interconnect express (PCIe), and compute express link (CXL).
- Design verification (DV) employing advanced verification methodologies such as universal verification methodology (UVM), to ensure code and functional coverage, performance validation, formal verification.
- Emulate testing on actual silicon with rapid iterative design validation using field programmable gate array (FPGA) prototyping.
- Transform logic design through the process of synthesis, floor planning, power planning, partitioning, placement, routing, static timing analysis (STA), and physical verification, creating an optimal physical design that combines power, performance, area, and timing requirements.
- Implement and integrate design-for-test (DFT) to enhance testability of silicon designs with scan insertion and test pattern generation, memory built-in self-test (BIST) logic insertion and verification, and joint test action group (JTAG) or boundary scan insertion.
- Achieve energy efficiency using low-power design expertise, including implementing power-gating and Adaptive voltage scaling (AVS).
- Implement design methodologies and computer-aided design (CAD) flow automation with advanced scripting, such as transaction control language (TCL) and Python to maximize reuse across design teams.
- Develop RISC-V based custom subsystems, SoCs and systems with expertise across instruction set architecture (ISA) customization, core configuration and integration, RISC-V compliance and verification, and firmware and compiler development.
With advanced package design, TCS can:
- Integrate and verify die-to-die (D2D) subsystems in system-on-chips (SoCs) based on UCIe™ and high bandwidth memory (HBM) interface specifications required to create futuristic chiplet-based multi-die systems.
- Co-design 2.5D and 3D interposers and multi-layer organic substrates to create advanced package designs with improved signal integrity, lower latency, and reduced footprint.
- Implement and integrate IEEE 1838 test access logic for integrated circuits in 2.5D and stacked-die packages to perform signal integrity and power integrity analyses, ensuring high data transfer quality.
Benefits
TCS’ services enable semiconductor companies to accelerate the tapeout of next-generation chips, secure critical design wins, and gain market leadership.
Using our services, companies can benefit from:
Rapid adoption of advanced silicon technologies: This will allow companies to tapeout next-generation devices based on chiplet architecture with expertise in advanced package design and UCIe™.
Cost optimization: Enterprises can customize chips and reduce the costs by using RISC-V ISA across peripherals, cores, and SoCs.
Product differentiation: Leverage TCS’ comprehensive silicon engineering capabilities coupled with industry and domain expertise across AI, automotive, communications, IoT, HPC to tapeout new and derivative chips.
Faster time to market: Backed by unique verification solutions, TCS’ offering will help semiconductor companies ensure first-time-right products based on advanced verification methodologies such as UVM and formal verification.
The TCS advantage
TCS has over three decades of experience and domain expertise in the semiconductor industry, with its collaboration-partner ecosystem enabling product engineering from chip to system.
TCS has deep domain expertise across the product development lifecycle, from concept to chip to systems, from design and market readiness to systems integration, deployment, and sustenance.
We specialize in developing custom chipsets across sectors such as automotive, communications, and consumer and industrial electronics. With experience in handling advanced technology nodes and developing solutions across emerging technology areas such as neuromorphic computing, quantum computing, processor-in-memory, advance packaging, our capabilities allow customers to co-design and deliver next-generation processing solutions.
Strategic partnerships with startups, academia, foundry, and co-innovation (TCS COIN™) partners, as well as our partner-collaboration ecosystem allow us to create differentiated solutions across the value chain, leading to new revenue streams for our customers.
